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Devices
| Device | Type | PHY modes | Manuf. | CPU1 | FLA1 | RAM1 | WI1 | WI2 | Switch | Ether. | Expan. | Ports | FCC date |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Nintendo 2DS (FTR-001) FCC ID: BKEFTR001N |
portable game console | bg |
Nintendo CPU CTR B 266 MHz 2 cores |
1,024 MiB1,073,741,824 B <br />8,388,608 Kib <br />1,048,576 KiB <br />8,192 Mib <br />1 GiB <br /> | 128 MiB134,217,728 B <br />1,048,576 Kib <br />131,072 KiB <br />1,024 Mib <br />0.125 GiB <br /> | Atheros AR6012 Is a module |
2014-05-06 | ||||||
| Nintendo 3DS (CTR-001) FCC ID: EW4DWMW028, MCLJ27H023 |
portable game console | bg |
Foxconn CoO: 
|
Nintendo CPU CTR 266 MHz 2 cores |
1,024 MiB1,073,741,824 B <br />8,388,608 Kib <br />1,048,576 KiB <br />8,192 Mib <br />1 GiB <br /> | 128 MiB134,217,728 B <br />1,048,576 Kib <br />131,072 KiB <br />1,024 Mib <br />0.125 GiB <br /> | Atheros AR6014G Is a module |
AIC3010B, ITG-3270, LIS331DH, S750, BQ24072, 93045A4 | IrDA
SD Card slot Speaker Microphone |
2010-04-30 | |||
| Nintendo Switch FCC ID: BKEHAC001 |
portable game console | abgn+ac |
Foxconn CoO:
|
nVIDIA Tegra X1 T210 1.0 GHz 8 cores |
32,768 MiB34,359,738,368 B <br />268,435,456 Kib <br />33,554,432 KiB <br />262,144 Mib <br />32 GiB <br /> | 4,096 MiB4,294,967,296 B <br />33,554,432 Kib <br />4,194,304 KiB <br />32,768 Mib <br />4 GiB <br /> | Broadcom BCM4356 Is a module |
ALC5639, PI3USB30532, MAX77621AEWI+T, MAX77620AEWJ+T, NFCBEA, MX25U4033E, M92T36, BCM20734UA1, FT9CJ, SH641, BQ24072, M92T55, M92T17, STDP2550 | Bluetooth 4.1
SD Card slot Audio 3.5 mm jack speakers fan |
2016-12-25 | |||
| Nintendo Wi-Fi USB Connector FCC ID: FDI-04600022-0 |
bg |
Gemtek WUBR-134GM CoO:
|
unk. | unk. | 2005-10-24 |
Models
- Nintendo 3DS XL New (SPR-002) (2015) • Teardown
- • Nintendo 1446 17 CPU LGR A - CPU (ARM core)
- • Samsung KLM4G1YEMD-B031 4GB - NAND Flash
- • Fujitsu 82MK9A9A 7LFCRAM 1445 962 - FCRAM
- • Atheros AR6014G-AL1C - Wi-Fi SoC
- • Texas Instruments 93045A4 49AF3NW G2 - PMIC
- • Renesas Electronics UC KTR 442KM13 TK14 - MCU
- • Texas Instruments AIC3010D 48C01JW - Codec IC
- • NXP S750 1603 TSD438C - Infrared IC
- • Texas Instruments PH416A - I/O Expander
- Nintendo 3DS XL (SPR-001) (2015) • Teardown
- • Nintendo 1446 17 CPU LGR A - CPU (ARM Core)
- • Samsung KLM4G1YEMD-B031 4GB - NAND Flash
- • Fujitsu 82MK9A9A 7LFCRAM 1445 962 - FCRAM
- • Atheros AR6014G-AL1C - Wi-Fi SoC
- • NXP S750 1603 TSD438C - Infrared IC
- • CPU: ARM11 MPCore @268MHz, ARM9 @134MHz
- • GPU: DMP PICA200 @268MHz
- • Flash: Toshiba THGBM2G3P1FBAI8 1GB
- • RAM: Fujitsu MB82M8080-07L 128MB (2x 64MB)
- • Wi-Fi: Atheros AR6014G-AL1C - Wi-Fi SoC
- • FCC ID: EW4DWMW028 (Mitsumi DWM-W028)
- • Audio: Texas Instruments AIC3010B (Codec IC)
- • Gyroscope: Invensense ITG-3270 MEMS
- • Accelerometer: STMicro LIS331DH
- Nintendo 2DS (FTR-001) •
- Nintendo N3DS (KTR-001)
- Nintendo N3DS XL (RED-001)
- Nintendo N2DS XL (JAN-001)
- Nintendo Switch (HAC-001) (2017) • Teardown
- System-on-chip used: Nvidia Tegra X1 @1.02GHz
- CPU: Quad-core Cortex-A57 + Quad-core Cortex-A53
- Memory: 4GB LPDDR4; Storage: 32GB eMMC
- Removable storage: microSD/HC/XC (up to 2TB)
- Display: 6.2" 1280×720p LCD (237ppi)
- Up to 1080p via HDMI while docked
- Nintendo Switch Lite (HDH-001/002) (2019) • Nintendo Switch Lite on Wikipedia
- Nintendo Switch OLED (HEG-001) (2021) • Teardown
- Nintendo Classic Mini (CLV-101) (2016) • HoneyLab
- • CPU: Allwinner R16 (Quad Core ARM Cortex-A7)
- • GPU: Mali-400MP2; Flash: Macronix (NAND); RAM: Nanya
- Nintendo Classic Super (EU/AU) - (2017)
Models Specifications
| Type | 3DS | 3DS XL | 2DS | N3DS | N3DS XL | N2DS XL |
|---|---|---|---|---|---|---|
| Model | CTR-001 | SPR-001 | FTR-001 | KTR-001 | RED-001 | JAN-001 |
| CPU (SoC) |
CPU CTR (1048 0H) CPU CTR (1214 32) |
CPU CTR A (1226 60) CPU CTR (1037 21) |
CPU CTR B (??) |
CPU LGR A (1444 86) |
CPU LGR A (1446 17) |
CPU LGR A |
| RAM (FCRAM) |
Fujitsu MB82M8080-07L 128MB (2x 64MB) |
Fujitsu MB82DBS16641 |
Fujitsu MB82DBS1664 |
?? | Fujitsu MB82MK9A9A |
Fujitsu MB82MK9A9A |
| Flash (Storage) |
Toshiba THGBM2G3P1FBAI8 1GB |
Changed between O3DS and N3DS parts depending on production date |
Samsung KLM4G1YEQC 4GB (in 1.3GiB SLC mode) or Toshiba THGBMBG4P1KBAIT 2GB (MLC, appr. 1.8GB usable) |
?? | ||
| Speaker, Microphone, Circlepad, Touch controller |
TI PAIC3010B 0AA37DW |
?? | ?? | TI AIC3010B 39C4ETW |
TI AIC3010D 48C01JW |
?? |
| Gyroscope | Invensense ITG-3270 MEMS |
?? | ?? | ?? | ?? | ?? |
| Accelerometer | STMicro LIS331DH 2048 33DH X1MAQ |
?? | ?? | ?? | ?? | ?? |
| Wi-Fi | Atheros AR6014G-AL1C |
?? | Atheros AR6012 |
?? | Atheros AR6014G-AL1C |
?? |
| Infrared IC | NXP S750 0803 TSD031C |
?? | ?? | ?? | NXP S750 1603 TSD438C |
?? |
| Custom MCU | Renesas UC CTR | ?? | Renesas UC CTR 324KM47 KG10 |
Renesas UC KTR | Renesas UC KTR 442KM13 TK14 |
?? |
| Power (PMIC) |
TI 93045A4 OAAH86W |
?? | ?? | TI 93045A4 38A6TYW G2 |
TI 93045A4 49AF3NW G2 |
?? |
| Wi-Fi SPI Flash |
Raw ID data: 20 58 |
?? | ?? | Raw ID data: 62 62 |
?? | ?? |
| Top Screen |
3.53" in, 3D | 4.88" in, 3D | 3.53" in | 3.88" in, 3D | 4.88" in, 3D | 4.88" in (?) |
| Bottom Screen |
3.00" in | 4.18" in | 3.00" in | 3.33" in | 4.18" in | 4.18" in (?) |
- [11] Official Documentation
- [5], [10] According to iFixit.com (Teardown):
- Datasheet for memory is for a chip in the same series, it has less
- memory than the one inside the 3DS (128MB vs 512MB).
- There is a trove of data on the FCC website at EW4DWMW028.
- [12] This IC is somewhat similar to NXP.
- The Raw ID data for Wi-Fi SPI Flash is from command 0x9F, RDID.
