Siemens SS2623
Siemens SS2623
Manuf (OEM/ODM): Accton WG3004A
FCC approval date: 13 June 2001
Country of manuf.: Taiwan
Type: wireless router
FCC ID: HEDWG3004A-17
Power: 5 VDC, 2.4 A
Connector type: barrel
CPU1: Samsung S3C4510
FLA1: 1 MiB1,048,576 B <br />8,192 Kib <br />1,024 KiB <br />8 Mib <br />9.765625e-4 GiB <br /> (Intel TE28F800B3B90)
RAM1: 8 MiB8,388,608 B <br />65,536 Kib <br />8,192 KiB <br />64 Mib <br />0.00781 GiB <br /> (EtronTech EM638325TS-6)
Expansion IFs: PCMCIA (16-bit), Parallel
PCMCIA slots: 1
WI1 module: unknown
WI1 module IF: PCMCIA (16-bit)
WI1 chip1: Intersil Model?
WI1 chip2: Intersil Model?
WI1 802dot11 protocols: b
WI1 antenna connector: none
ETH chip1: Samsung S3C4510
Switch: Marvell 88E6050
LAN speed: 100M
LAN ports: 3
WAN speed: 100M
WAN ports: 1
b
Default SSID: SpeedStream (4 addl. devices)
Default IP address: 192.168.254.254
the IP 192.168.254.254 is used by 11 additional devices
of which 7 are Siemens devices
Default login user: blank
Default login password: admin
blank:admin credentials used by 300 additional devices
of which 0 are Siemens devices
| FCC ID | |
|---|---|
| Acer Home Gateway | HEDWG3004A-17 |
| Belkin F5D6230-3 | K7SF5D62303 HEDWG3004A-17 |
| Enterasys RBTR1-AX | HEDWG3004A-17 |
For a list of all currently documented Intersil chipsets with specifications, see Intersil.
For a list of all currently documented Samsung chipsets with specifications, see Samsung.
"P/N: 142004-405 REV: 01" and "MADE IN TAIWAN R.O.C" is silkscreened on the board.
The card appears to identify the same as the card inside the Belkin F5D6230-3.
Images
board top, card in
card back
board top
flash
